| Description |
The Elite Etch from RKD Engineering is an Automated Mixed Acid Decapsulator that enables high productivity through the integration of advanced features, made possible by the use of modern materials and design concepts. RKD's Elite Etch Decapsulator rapidly and easily opens even the most delicate packages by delivering precise, micro aliquots of nitric, sulfuric, or mixes of these acids to the package with no sample damage. |
Elite Etch System Specification
General Specification: |
Dimensions (W x D x H)-
Decapsulator- |
7.5 x 12.5 x 12 inch
190 x 318 x 305 MM |
| Bottle assembly- |
10 x 5 x 11 inch
254 x 127 x 279 MM |
| Weight- |
Approx. 35lbs (16Kg)
|
| Gas pressure- |
70 psi (N2) or CDA |
| Power source- |
90 to 250 VAC |
| Acid temp. range- |
20°C to 250°C |
| Acid temp. set point- |
1.0°C ± 0.1°C |
| Etch cavity (up to)- |
22 x 22MM 22 X 22mm |
Software Operational Specification-
Acid selection- |
Fuming or concentrated sulfuric acid
Fuming or concentrated nitric acid
mixed acids NOTE: All mix ratios are dynamically prepared within pumping assembly. |
| Acid mix ratios- |
(nitric to sulfuric ratios)
9:1, 5:1, 4:1, 3:1, 2:1, 1:1 |
| Post etch rince options- |
Fuming sulfuric acid
Fuming nitric acid
mixed acids
no rinse
NOTE: Acid rinse temperature settings are automatically calibrated to etch temperature etch times-
1 to 1,800 seconds, in 1 sec. increments
Note: Etch time can be dynamically adjusted during etch process etch modalities |
| Temperature ranges- |
NOTE: PULSE is a superior approach to maximizing the carrying capacity for the etch acid(s) within the package volume. It allows superior etch characteristics when nitric acid or mixed acids are selected. |
| Etch temperature ranges- |
20°C to 90°C (nitric acid)
20°C to 250°C (sulfuric acid)
20°C to 100°C (mixed acids) |
| Etch volume selection- |
1 to 8ml per minute for all acids and acid mixes. |
| Operator program storage- |
100 programs- stores to non-volatile memory |
| Software upgrades- |
(i) via RS232 or USB computer link
(ii) Hand held replacement |
Note: Technical specification subject to change without notice.
| Description |
Elite Etch -Cu is an Automated Mixed Acid Decapsulator, with advanced feature integration to enable high productivity. This decapsulator easily and rapidly opens even the most delicate packages by delivering precise, micro-aliquots of nitric, sulfuric, or acid mixes to the package with no sample damage. |
Elite Etch Cu System Specification
General Specification: |
| Dimensions - |
Decapsulator: 7.5 X 12.5 X 12 inch (190 X 318 X 305mm)
Bottle assembly: 10 X 5 X 11 inch (254 X 127 X 279mm) |
| Weight - |
Approx. 35lbs (16kg) |
| Power source- |
90 - 130 or 230 - 250 VAC ~ 49 to 61 Hz |
| Acid temp. range- |
10°C to 250°C. Independent of ambient room temperature. |
| Acid temp. set point- |
1.0°C ± 1% of setting. Independent of ambient temperature. |
| Etch cavity (up to)- |
21mm X 21mm (30mm max. diagonal) |
| Choice of acids- |
fuming nitric acids, mixed fuming nitric acid and sulfuric acids, or fuming/concentrated sulfuric acid. |
| Acid mix ratios- |
(nitric to sulfuric ratios) 9:1, 6:1, 5:1, 4:1, 7:2, 3:1,
5:2, 2:1, 3:2, 1:1, 1:2, 1:3, 1:4, 1:5 |
| Post etch rinse options- |
sulfuric acids, fuming nitric acids, mixed acids, or no rise. |
| Etch times- |
1 to 2,400 seconds in 1 sec increments (1 sec to 40 minutes) dynamic (real time) adjustment of etch time |
| Etch modalities- |
Pulse Etch (PULSE), reciprocal etch acid pulse (REAP)
NOTE: PULSE is a superior approach to maximizing the carrying capacity for the etch acid(s) within the package volume. It allows superior etch characteristics when nitric acid or mixed acids are selected. |
| Temperature ranges- |
20°C - 90°C (nitric acid) 20°C - 250°C (sulfuric acid); 10°C - 100°C (mixed acids) |
| Etchant volume selection- |
mixes at a temperature above 100°C
2 to 8ml per minute for nitric acid or mixed acids below 100°C |
| Operator Program storage- |
100 programs stored to non-volatile memory |
| Ambient temperature- |
15°C to 26°C |
| Ambient humidity- |
0 to 70% non-condensing |
Note: Technical specification subject to change without notice.
| Description |
Elite Etch -Cu ESD is an Automated Mixed Acid Decapsulator, with advanced feature integration to enable high productivity. This Decapsulator easily and rapidly opens even the most delicate packages by delivering precise, micro-aliquots of nitric, sulfuric, or acid mixes to the package with no sample damage. |
Elite Etch ESD Cu System Specification
General Specification: |
| Dimensions - |
Decapsulator 7.5 X 12.5 X 12 inch (190 X 318 X 305MM)
Bottle assembly 10 X 5 X 11 inch (254 X 127 X 279MM) |
| Weight - |
Approx. 35lbs (16kg) |
| Power source- |
90 - 130 or 230 - 250 VAC ~ 49 to 61 Hz |
| Acid temp. range- |
10°C to 250°C. Independent of ambient room temperature |
| Etch cavity (up to)- |
21MM X 21MM. (30MM. Max. diagonal) |
| Choice of acids- |
fuming nitric acids, mixed fuming nitric and sulfuric acids, or fuming/concentrated sulfuric acid. |
| Acid mix ratios- |
(nitric to sulfuric acids) 9:1, 6:1, 5:1, 4:1, 7:2, 3:1, 5:2, 2:1
3:2, 1:1, 1:2, 1:3, 1:4, 1:5 |
| Post Etch Rinse Options- |
sulfuric acids, fuming nitric acids, mixed acids, or no rinse. |
| Etch times- |
1 to 2,400 seconds in 1 sec increments (1 sec to 40 minutes) dynamic (real time) adjustment of etch time |
| Etch Modalities- |
Pulse Etch (PULSE), Reciprocal Etch Acid Puls (REAP) Note: PULSE is a superior approach to maximizing the carrying capacity for the etch acid(s) within the package volume. It allows superior etch characteristics when nitric acid or mixed acids are selected. |
| Temperature Ranges- |
20°C- 90°C (nitric acid) 20°C-250°C (sulfuric acid);
10°C-100°C (mixed acids) |
| Etchant Volume Selection- |
2 to 6 ml per minute - for all acids & acid mixes at a temperature above 100°C 2 to 8 ml per minute for nitric acid or mixed acids below 100°C. |
| Operator Program Storage- |
100 programs stores to non-volatile memory |
| Ambient Temperature Range- |
15°C to 26°C |
| Ambient Humidity- |
0 to 70% non-condensing |
Note: Technical specification subject to change without notice.