ULTRAPREP

Large Die Backside Thinning with 

Minimal Thickness Variation

Fast, easy setup, including alignment

NANOPREP

Die Backside Thinning and more...

Fast, easy setup, including alignment

• Simple operator interface with full process prgrammability

• System automation of thinning and polishing processes

• Programmable depth, accurate to +/- 1 microns

• Removable sample holders- allow removal of samples without remounting or realignment.

• Contour Tool Path for grinding, lapping, polishing.

• Eliminates "Stair Stepping" Die cracking, Die levelling, die thickness variation.

• Easy removal of heat spreaders, encapsulant, die attach pad

• Available inexpensive tooling

• Small footprint- takes minimal bench space

• Simple operator interface with full process.

• Programmability

• System automation of thinning and polishing processes

• Programmable depth, accurate to +/-5 microns

• Removable sample holders- allow removal of samples without remounting or realignment.

• Compliant Tool Pathway for: Grinding, Lapping, Polishing

• Eliminates "stair stepping" Die cracking

• Easy removal of heat spreaders, encapsulant, die attach pad

• Available inexpensive tooling

• Small footprint- takes minimal bench space  

• Machine size 375mm high, 375mm wide, 350mm deep

• Weight: 30 Kg

• Power requirements: 90 to 250 VAC , 49 to 61 Hertz at 4 amps maximum

• X axis travel 60mm

• Y axis travel 55mm

• Z axis travel 55mm

• Maximum speed: 500mm/minute

• Resolution 5 microns in X and Y, 1 micron in Z

• Positional accuracy +/-2.5 microns per millimeter of travel

• Spindle axis accuracy +/-0.67 milli-radians normal to fixture plane

• Z axis repeatability +/-2 microns

• Maximum spindle speed 10,000 RPM

• Tool holder special 3.18mm (0.125inch) shank tool holder (other shank diameters are available on request)

• Number of media pumps 3; one to supply grinding lubricant, and two for delivering slurries for the lapping and polishing processes

• Media pump flow rate 0.1 to 3.5ml per minute

• Heated stage temp range 20 to 80 degrees C

• Temperature accuracy +/-2 degrees C

• Data logging included and accessible via RS 232 connection. Data output is comma delimited format for  comprehensive analysis, storage and retrieval as necessary. 

• Machine size: 375mm high, 370mm wide, 330mm deep

• Weight: 20 Kg

• Power requirements: 90 to 250 VAC , 49 to 61 Hertz at 4 amps maximum

• Interface 9 pin "D-sub" serial port to connect to hand-held controller

• X axis travel 75mm

• Y axis travel 75mm

• Z axis travel 75mm (57mm with tool installed)

• Maximum speed : 500 mm/minute

• Resolution 5 microns in X and Y

• Positional accuracy +/-2.5 microns per millimeter of travel

• Spindle axis accuracy +/-0.67 milli-radians normal to fixture plane

• Z axis repeatability +/-2 microns without re-zero

• Maximum spindle speed 7,000 RPM

• Tool holder special 3.18mm (0.125inch) shank tool holder (other shank diameters are available on request)

• Tool preset Height: 17.78mm